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| Tuesday, September 27, 2011 |
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Toshiba Corporation Selects Applied Materials' Predictive Scheduling Solution to Boost Lithography Efficiency |
| Applied Materials, Inc. today announced that semiconductor and storage products company Toshiba Corporation has purchased Applied's SmartSched(R) predictive scheduling software to improve the capacity and efficiency of its photolithography operations. more info >> |
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| Monday, September 19, 2011 |
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Applied Materials Clears Critical Roadblock to EUV Lithography with New Photomask Etch System |
| Applied Materials, Inc. today advanced the state-of-the art in photomask technology with its new Applied Centura(R) Tetra(TM) EUV Advanced Reticle Etch system. more info >> |
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| Wednesday, September 14, 2011 |
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Applied Materials Announces Cash Dividend |
| Applied Materials, Inc. (NASDAQ:AMAT) today announced that its Board of Directors has approved a quarterly cash dividend of $0.08 per share payable on the company's common stock. The dividend is payable on December 14, 2011 to stockholders of record as of November 23, 2011. more info >> |
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| Thursday, September 1, 2011 |
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Applied Materials to Present at 2011 Citi Technology Conference |
| Applied Materials, Inc. (NASDAQ:AMAT) will participate in an upcoming investor conference. more info >> |
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| Thursday, August 25, 2011 |
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Applied Materials Delivers Strong Third Quarter Results |
| Applied Materials, Inc. (NASDAQ: AMAT), the world's leading supplier of manufacturing solutions for the semiconductor, display and solar industries, today reported results for its third quarter of fiscal 2011 ended July 31, 2011. more info >> |
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| Tuesday, July 12, 2011 |
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Applied Materials Highlights Innovations for Semiconductor Manufacturing at Semicon West 2011 - Showcases Eight New Products |
| Applied Materials, Inc. will showcase its technology innovations for producing future generations of microchips this week at Semicon West 2011 in San Francisco. more info >> |
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Applied Materials Speeds Chip Interconnects with High-Performance, Power-Efficient, Low-k Technology |
| Applied Materials, Inc. today introduced its latest technology for building fast, low power interconnects in logic devices at the 22nm node and below with the Applied Producer(R) Black Diamond(TM) 3 deposition system and Applied Producer(R) Nanocure(TM) 3 UV curing system. more info >> |
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Applied Materials Pushes the Boundaries of the Transistor with Atomic Scale Manufacturing Technology |
| Applied Materials, Inc. today launched its Applied Centura(R) Integrated Gate Stack(TM) system for creating the critical gate dielectric structures in 22nm logic chips. more info >> |
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| Monday, May 9, 2011 |
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Applied Materials' HCT B5 Wire Saws Selected by GCL-Poly for Solar Manufacturing |
| Applied Materials, Inc., the leading equipment supplier to the solar photovoltaic (PV) industry, announced today that GCL-Poly Energy Holdings Ltd., China's largest producer of polysilicon wafers for solar PV applications in 2010, has placed a significant order for Applied's HCT B5TM wire saws. more info >> |
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| Wednesday, April 13, 2011 |
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Applied Materials and Singapore's Institute of Microelectronics to Set Up Advanced Packaging Center |
| Applied Materials today signed an agreement with the Institute of Microelectronics (IME), a research institute under the A*STAR, to set up a Center of Excellence in Advanced Packaging in Singapore. more info >> |
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