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| Monday, 3 December 2012, 20:35 HKT | |
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Source: Applied Materials, Inc. | |
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Santa Clara, Calif., Dec 3, 2012 - (ACN Newswire) - The 14 nanometer node is expected to be an inflection point for the chip industry, beyond which the resistivity of copper interconnects will increase exponentially and may become a limiting factor in chip design. On December 11, 2012, Applied Materials, Inc. will host an important forum in San Francisco to explore the path that interconnect technology must take to keep pace with transistor scaling and the transition to new 3D architectures.
The discussion will address critical questions for the semiconductor industry, including the possibility of replacing copper as the material of choice for interconnect structures. If not, will new circuit designs and system architectures be able to address future limitations in interconnect performance? The complexity of multi-patterning and EUV timing may also impact chipmakers' interconnect pitch scaling roadmaps.
Guest speakers from across the industry will provide insights on these critical issues in a panel titled "Interconnect Performance - Overcoming the Impact of Transistor Scaling." To register for this exceptional event, please visit www.appliedmaterials.com/interconnect-panel .
Introduction: Klaus Schuegraf, Ph.D., Vice president and chief technology officer, Silicon Systems Group, Applied Materials, Inc.
Panel:
Robert Aitken, Ph.D., Fellow, ARM Holdings, Ltd.
Jon Candelaria, Director, interconnect and packaging sciences, Semiconductor Research Corp.
Dinesh Somasekhar, Ph.D., Senior scientist, Intel Corp.
Zsolt Tokei, Ph.D., Program director, nano interconnects, IMEC
Mehul Naik, Ph.D., Distinguished member of technical staff, Applied Materials, Inc.
Douglas Yu, Ph.D., Senior director, backend R&D, TSMC, Ltd.
David Lammers (moderator), Contributing editor, SemiMD.com
Where: Hotel Nikko
222 Mason Street, San Francisco, CA 94102
When: Tuesday, December 11, 2012
Schedule:
5:00pm - 6:15pm Registration and Reception
6:15pm - 7:40pm Panel Discussion
7:40pm - 8:00pm Beverages/Social
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing innovative equipment, services and software to enable the manufacture of advanced semiconductor, flat panel display and solar photovoltaic products. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world. Learn more at www.appliedmaterials.com .
Contact:
Connie Duncan (editorial/media) +1-408-563-6209
Michael Sullivan (financial community) +1-408-986-7977
This announcement is distributed by Thomson Reuters on behalf of Thomson Reuters clients.
The owner of this announcement warrants that:
(i) the releases contained herein are protected by copyright and other applicable laws; and
(ii) they are solely responsible for the content, accuracy and originality of the information contained therein.
Source: Applied Materials via Thomson Reuters ONE
Topic: Press release summary
http://www.acnnewswire.com
From the Asia Corporate News Network
Copyright © 2013 ACN Newswire. All rights reserved. A division of Asia Corporate News Network.
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