English | 简体中文 | 繁體中文 | 한국어 | 日本語
Tuesday, 2 October 2018, 10:05 HKT/SGT
Share:
ASMPT well-positioned to leverage high growth of advanced semiconductor packaging with NEXX purchase

Singapore, Hong Kong, Oct 2, 2018 - (ACN Newswire) - ASM Pacific Technology Ltd. (ASMPT), the world leader in semiconductor assembly and packaging equipment, announced that on 1 October 2018 it has completed its acquisition of TEL NEXX, Inc (NEXX) from Tokyo Electron Limited (TEL). TEL NEXX will be subsumed under the Back-End Equipment segment of ASMPT.

The acquisition is another major step by ASMPT in pursuing their strategy of tapping into new high growth markets and expanding their product offerings to the advanced semiconductor packaging market.

Established in 2001, NEXX is an industry leader in the advanced packaging market and has strong technological capabilities in the highly specialized Electrochemical Deposition (ECD) and Physical Vapor Deposition (PVD) technologies. Integrating NEXX's technologies with ASMPT's broad product range and global support will enable the Group to expand their business portfolio and continue to offer the most innovative solutions to their customers.

"With the TEL NEXX acquisition, ASMPT is now uniquely positioned as the integral "Interconnect" company offering a one-stop shop of interconnect solutions in the packaging and surface mount market segments. We can now provide the broadest portfolio of interconnect solutions in the industry. This includes wire bond, flip chip, thermocompression bonding, and together with NEXX's PVD and ECD equipment, we can offer film interconnect solutions inclusive of UBM (Under Bump Metallization), Cu Pillar (Fine Pitch Copper Pillar), TSV (Through Silicon Via) and RDL (Redistribution Layer), just to name a few," said Mr Lee Wai Kwong, CEO of ASMPT.

Under the new ASMPT's NEXX organisation, Tom Walsh will remain as ASM NEXX President, reporting to CK Lim, Vice President/Deputy CEO, Back-End Equipment Segment.

About ASM Pacific Technology Limited
As a global technology and market leader, ASMPT (HKEX stock code: 0522), develops and provides leading edge solutions and materials for the semiconductor assembly and packaging industries. Its surface mount technology solutions are deployed in a wide range of end-user markets including electronics, mobile communications, automotive, industrial, LED and alternative energy. The company's continuous investments in research and development help to provide its customers with innovative and cost-efficient solutions and systems that enable them to achieve higher productivity, greater reliability and enhanced quality.

Listed on the Hong Kong Stock Exchange since 1989, ASMPT is currently one of the constituent stocks on the Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes, the Hang Seng Hong Kong 35 Index and the Hang Seng Global Composite Index. To learn more about ASMPT, please visit its website at www.asmpacific.com.

For further information, please contact:

Sally Chew
Director, Corporate Communications
Office: +65 6752 6311
Mobile: +65 98392641
Email: [email protected]


Topic: Press release summary
Sectors: Electronics, Daily Finance, Daily News
http://www.acnnewswire.com
From the Asia Corporate News Network


Copyright © 2018 ACN Newswire. All rights reserved. A division of Asia Corporate News Network.

 

Latest Press Releases
Showa Denko Announces Notice Regarding the Repurchase of Own Shares  
Dec 11, 2018 13:00 HKT/SGT
Showa Denko Forecasts Payment of Term-end Dividend  
Dec 11, 2018 13:00 HKT/SGT
Showa Denko Maps Out New Medium-term Business Plan "The TOP 2021"  
Dec 11, 2018 13:00 HKT/SGT
Lubrizol Announces Strategic Alliance with Vidalia Denim for Sustainably-Produced Denim Featuring X4zol(TM)-J Stretch Fibers  
Dec 11, 2018 07:00 HKT/SGT
GoSecurity announces integration plans for Blockpass KYC Solution  
Dec 10, 2018 21:00 HKT/SGT
Disposal of Inn Hotel Hong Kong by Emperor International at HK$1.1 Billion with Gain of Approximately HK$746 Million  
Dec 10, 2018 19:57 HKT/SGT
New Technologies Enhance Franchise Management  
Dec 10, 2018 15:30 HKT/SGT
MHPS: Midwest Utility Orders Game-Changing SmartER GAC Gas Turbine  
Dec 10, 2018 14:42 HKT/SGT
TOYOTA GAZOO Racing to Exhibit GR Supra Super GT Concept at the Tokyo Auto Salon  
Dec 10, 2018 10:30 HKT/SGT
MHPS Receives Trainees from Vietnam Electricity (EVN)  
Dec 10, 2018 10:05 HKT/SGT
More Press release >>
Copyright © 2018 ACN Newswire - Asia Corporate News Network
Home | About us | Services | Partners | Events | Login | Contact us | Privacy Policy | Terms of Use | RSS
US: +1 800 291 0906 | Beijing: +86 10 8405 3688 | Hong Kong: +852 2217 2912 | Singapore: +65 6304 8926 | Tokyo: +81 3 6721 7212

Connect With us: