English | 简体中文 | 繁體中文 | 한국어 | 日本語
Friday, 12 June 2015, 12:47 HKT/SGT

Source: Hua Hong Semiconductor
Hua Hong Semiconductor Launches 0.11um Ultra-Low-Leakage Embedded Flash Process Platform That Delivers Powerful MCU Solutions for IoT

HONG KONG, June 12, 2015 - (ACN Newswire) - Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347), a global leading pure-play 200mm foundry, announced today to launch its latest process platform for 0.11um Ultra-Low-Leakage (ULL) eFlash and EEPROM. The technology is a continuation of Hua Hong Semiconductor's 0.18um ULL process offering to provide customers a differentiated and cost effective solution with high performance and low power consumption.

The launched 0.11um ULL eFlash process platform allows for down to 1.08V low voltage operation condition and less than 0.2pA/um ultra-low-leakage features. Its memory IP posses unique advantages such as 100,000 to 500,000 write/erase endurance cycles, read speed down to 20ns and in particular, its dynamic power consumption attains 25uA/MHz while static power consumption attains 50nA, which can greatly extend the battery life and standby time of the hottest Internet of Things (IoT) and wearable devices. The platform also features highly integrated logic units and contains a power management unit with gate density over 300K gate/mm2, which could further reduce chip area.

The most important features of the platform are the capability of integration of RF, eFlash and EEPROM designs at the same technology platform, and low mask count manufacturing down to 24 photo layers. It allows chip design to have a smaller area, lower power consumption, higher reliability while saving costs in terms of design, manufacturing and test. Coupled with a diversified range of embedded memory IPs, high-density standard cell library and memory compliers, the 0.11um ULL eFlash process platform offers a comprehensive, flexible and cost-effective solution tailored for customers' needs and reduces their products' time-to-market.

The low-power MCUs built on 0.11um ULL eFlash process technology are suitable for a variety of energy-saving smart products such as IoT, wearable devices, smart grids, embedded smart connected devices, medical electronics, lighting, industrial and automotive electronics applications.

"The 0.11um ULL eFlash process platform achieves a perfect integration of ultra-low-power digital-analog mixed signal technology, embedded flash technology and low-cost RF CMOS technology, thus significantly boosting the competitiveness of customers' products. MCU will be largely required in IoT, and the market size of IoT is expected to grow from 25 billion US dollars in 2013 to 60.2 billion US dollars in 2020," said Dr. Weiran Kong, Executive Vice President of Hua Hong Semiconductor. "The 0.11um ULL eFlash technology developed for IoT further expands the extensive portfolio of technology platforms for low-power embedded flash to meet diversified market demands."

Topic: Press release summary
Source: Hua Hong Semiconductor

Sectors: Electronics, Daily Finance, Optoelectronics
From the Asia Corporate News Network

Copyright © 2021 ACN Newswire. All rights reserved. A division of Asia Corporate News Network.


Hua Hong Semiconductor Releated News
June 3, 2021 12:32 HKT/SGT
June 3, 2021 12:31 HKT/SGT
June 3, 2021 12:30 HKT/SGT
Hua Hong Semiconductor Achieved Mass Production of 12'' 90nm BCD
Aug 27, 2020 13:02 HKT/SGT
华虹半导体最新推出90纳米超低漏电嵌入式闪存工艺平台 助力大容量MCU解决方案
Aug 27, 2020 13:01 HKT/SGT
華虹半導體最新推出90納米超低漏電嵌入式閃存工藝平台 助力大容量MCU解決方案
More news >>
Copyright © 2021 ACN Newswire - Asia Corporate News Network
Home | About us | Services | Partners | Events | Login | Contact us | Cookies Policy | Privacy Policy | Disclaimer | Terms of Use | RSS
US: +1 214 890 4418 | Beijing: +86 400 879 3881 | Hong Kong: +852 8192 4922 | Singapore: +65 6549 7068 | Tokyo: +81 3 6859 8575