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| Press Releases |
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| Tuesday, September 13, 2011 |
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田中貴金屬工業擴充電子束焊接材料之產品陣容 針對汽車用感測器，全新加入七項產品 |
| TANAKA HOLDINGS Co., Ltd（總公司：千代田區丸之內、執行總裁：岡本英彌）發表經營田中貴金屬集團製造事業的田中貴金屬工業株式會社（總公司：千代田區丸之內、執行總裁：岡本英彌），擴充了使用於各種汽車用感測器零件滑動接點（※1）的電子束焊接材料產品陣容。 more info >> |
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Tanaka Precious Metals Expands Lineup of Electron Beam Welding Materials; Seven New Products Released for Automotive Sensors |
| TANAKA HOLDINGS Co., Ltd. (a company of Tanaka Precious Metals) today announced that Tanaka Kikinzoku Kogyo K.K., which operates the Tanaka Precious Metals' manufacturing business, has expanded its product lineup of electron beam welding materials used in sliding contacts (1) on various automotive sensors. more info >> |
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| Thursday, August 4, 2011 |
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Tanaka Precious Metals First to Obtain ISO/IEC17025 Accreditation for Platinum and Palladium Analysis Technology in Japan |
| TANAKA HOLDINGS Co., Ltd. (a company of Tanaka Precious Metals) today announced that the TKG Laboratory Center of Tanaka Kikinzoku Kogyo K.K., which operates the Tanaka Precious Metals' manufacturing business became the first company in Japan to acquire ISO/IEC 17025:2005 accreditation for platinum and palladium analysis technology. more info >> |
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| Tuesday, July 12, 2011 |
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다나까 귀금속 그룹과 SUSS MicroTec, 서브마이크론 금 입자의 패턴 전사 및 접합 기술을 공동 개발 |
| 다나까 귀금속 공업 주식회사(1)(본사: 도쿄도 치요다구 마루노우치, 사장 겸 최고경영자 오카모토 히데야) 및 SUSS MicroTec KK(본사: 카나가와현 요코하마시, 대표이사 레이몬드 로우)가 서브마이크론 크기의(10,000분의 1mm) 금 입자를 이용한 패턴 전사 및 접합 기술을 공동 개발합니다. more info >> |
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田中贵金属工业与休斯微技术合作发展次微米级金粒子图案转印及接合技术 |
| 田中贵金属工业株式会社（1）（总公司：东京千代田区丸之内；执行总裁：冈本英弥） 和休斯微技术公司（总公司：神奈川县横滨；执行总裁：Raymond Lau） 将合作共同开发使用次微米级（1/10,000毫米）金粒子的图案转印及接合技术。 more info >> |
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田中貴金屬工業與休斯微技術合作發展次微米級金粒子圖案轉印及接合技術 |
| 田中貴金屬工業株式會社（1）（總公司：東京千代田區丸之內；執行總裁：岡本英彌） 和休斯微技術公司（總公司：神奈川縣橫濱；執行總裁：Raymond Lau） 將合作共同開發使用次微米級（1/10,000毫米）金粒子的圖案轉印及接合技術。 more info >> |
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Tanaka Precious Metals and SUSS MicroTec to Jointly Develop Sub-micron Gold Particle Pattern Transfer and Bonding Technology |
| Tanaka Kikinzoku Kogyo K.K.(1) and SUSS MicroTec KK will begin joint development of pattern transfer and bonding technology using sub-micron sized (1/10,000mm) gold particles. more info >> |
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| Monday, July 11, 2011 |
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다나까전자공업, 동(Cu)본딩 와이어를 3개 거점에서 생산 |
| TANAKA 홀딩스 주식회사(본사: 치요다구 마루노우치)는 본딩 와이어(배선재) 제조분야에서 세계 최고의 시장 점유율을 자랑하는 다나까 귀금속 그룹의 다나까 전자공업 주식회사가 동(Cu) 본딩 와이어의 생산을 일본과 중국, 싱가포르의 3개 거점 체제로 전환했음을 발표합니다. more info >> |
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田中电子工业三大据点生产铜Bonding Wire分散供给风险，促使产能倍增 |
| TANAKA HOLDINGS Co., Ltd.（总公司：千代田区丸之内、执行总裁：冈本英弥）发表Bonding Wire（配线材）市场占有率世界排名第一的田中贵金属集团田中电子工业株式会社（总公司：东京都千代田区、执行总裁：笠原康志），推出以日本、中国、新加坡为三大据点，生产铜Bonding Wire之体制。 more info >> |
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田中電子工業三大據點生產銅Bonding Wire分散供給風險，促使產能倍增 |
| TANAKA HOLDINGS Co., Ltd.（總公司：千代田區丸之內、執行總裁：岡本英彌）發表Bonding Wire（配線材）市場佔有率世界排名第一的田中貴金屬集團田中電子工業株式會社（總公司：東京都千代田區、執行總裁：笠原康志），推出以日本、中國、新加坡為三大據點，生產銅Bonding Wire之體制。 more info >> |
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