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Tuesday, July 12, 2011
田中貴金屬工業與休斯微技術合作發展次微米級金粒子圖案轉印及接合技術
Tanaka Precious Metals and SUSS MicroTec to Jointly Develop Sub-micron Gold Particle Pattern Transfer and Bonding Technology
Monday, July 11, 2011
다나까전자공업, 동(Cu)본딩 와이어를 3개 거점에서 생산
田中电子工业三大据点生产铜Bonding Wire分散供给风险,促使产能倍增
田中電子工業三大據點生產銅Bonding Wire分散供給風險,促使產能倍增

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