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Press Releases |
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Wednesday, April 22, 2015 |
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Hua Hong Semiconductor Achieved Mass Production of the New-Generation 700V BCD Process Solutions to Boost LED Lighting Industry |
Today, Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347), a global leading pure-play 200mm foundry, announced that it has achieved mass production of its new-generation ultra-high voltage 0.5um 700V BCD series process platform with over 98% yield, reached the world-class production level. more info >> |
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Monday, March 23, 2015 |
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华虹半导体与力旺电子强强联合 借势MCU布局物联网 |
全球领先的200mm纯晶圆代工厂——华虹半导体有限公司(「华虹半导体」或「公司」,连同其附属公司,统称「集团」,股份代号:1347)与嵌入式非易失性存储器 more info >> |
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華虹半導體與力旺電子強強聯合 借勢MCU佈局物聯網 |
全球領先的200mm純晶圓代工廠——華虹半導體有限公司(「華虹半導體」或「公司」,連同其附屬公司,統稱「集團」,股份代號:1347)與嵌入式非揮發性記憶體 more info >> |
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Hua Hong Semiconductor and eMemory Technology Build Powerful Alliance to Prepare for IoT by Taking Advantage of MCU |
Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group", stock code: 1347), a leading pure-play 200mm foundry in the world more info >> |
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Friday, March 13, 2015 |
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华虹半导体与丽恒光微联手推出全球最小气压计 |
全球领先的200mm纯晶圆代工厂── 华虹半导体有限公司(「华虹半导体」或「公司」,连同其附属公司,统称「集团」,股份代号:1347)与丽恒光微电子科技有限公司(「丽恒光微」)今日共同宣布,联合推出全球最小气压计PS3606,其采用华虹半导体创新的MEMS制造技术和丽恒光微的单芯片集成传感器方案设计,整个传感器产品尺寸1.1毫米x0.9毫米,厚度仅为0.45毫米。该产品也是全球第一款采用晶圆级封装的单芯片集成气压计。 more info >> |
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華虹半導體與麗恆光微聯手推出全球最小氣壓計 |
全球領先的200mm純晶圓代工廠── 華虹半導體有限公司(「華虹半導體」或「公司」,連同其附屬公司,統稱「集團」,股份代號:1347)與麗恆光微電子科技有限公司(「麗恆光微」)今日共同宣佈,聯合推出全球最小氣壓計PS3606,其採用華虹半導體創新的MEMS製造技術和麗恆光微的單芯片集成傳感器方案設計,整個傳感器產品尺寸1.1毫米x0.9毫米,厚度僅為0.45毫米。該產品也是全球第一款采用晶圓级封装的單芯片集成氣壓計。 more info >> |
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Hua Hong Semiconductor Partners with Lexvu to Launch World's Smallest Barometer |
Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group", stock code: 1347), a leading pure-play 200mm foundry in the world more info >> |
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Friday, February 27, 2015 |
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华虹半导体推出0.2微米射频SOI工艺设计工具包 |
全球领先的200mm纯晶圆代工厂 ── 华虹半导体有限公司(「华虹半导体」或「公司」,连同其附属公司,统称「集团」,股份代号:1347)今日宣布推出全新的0.2微米射频SOI (绝缘体上硅)工艺设计工具包(Process Design Kit,PDK)。 more info >> |
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華虹半導體推出0.2微米射頻SOI工藝設計工具包 |
全球領先的200mm純晶圓代工廠 ── 華虹半導體有限公司(「華虹半導體」或「公司」,連同其附屬公司,統稱「集團」,股份代號:1347)今日宣佈推出全新的0.2微米射頻SOI (絕緣體上矽)工藝設計工具包(Process Design Kit,PDK)。 more info >> |
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Hua Hong Semiconductor Launches 0.2um RF SOI Process Design Kit |
Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group", stock code: 1347), a leading pure-play 200mm foundry in the world, announced today that the launch of its 0.2um Radio Frequency ("RF") Silicon On Insulator ("SOI") process design kit ("PDK"). more info >> |
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