English | 简体中文 | 繁體中文 | 한국어 | 日本語
  Press Releases
Wednesday, March 9, 2016
基於華虹半導體eNVM工藝技術的華大電子雙介面金融IC卡芯片獲得國際EMVCo芯片安全認證證書
HED's Dual-interface Bank IC Card Based on Hua Hong Semiconductor's eNVM Process Obtains an EMVCo Security Certification
Monday, February 29, 2016
华虹半导体与灵动微电合作开发应用于物联网的系列IP
華虹半導體與靈動微電合作開發應用於物聯網的系列IP
Hua Hong Semiconductor Cooperates with MindMotion to Develop IP Platform Targeting IoT Smart Hardware
Friday, December 18, 2015
TMC THD88/M2064 Chip Passes International CC Security Certification
Friday, September 18, 2015
华虹半导体推出0.18微米数模混合及嵌入式OTP/MTP工艺平台增强版
華虹半導體推出0.18微米數模混合及嵌入式OTP/MTP工藝平台增強版
Hua Hong Semiconductor Launches Enhanced 0.18CE Process Platform Version
Wednesday, August 5, 2015
华虹半导体2015年上半年智能电表芯片出货量创历史新高

Copyright © 2022 ACN Newswire - Asia Corporate News Network
Home | About us | Services | Partners | Events | Login | Contact us | Cookies Policy | Privacy Policy | Disclaimer | Terms of Use | RSS
US: +1 214 890 4418 | China: +86 181 2376 3721 | Hong Kong: +852 8192 4922 | Singapore: +65 6549 7068 | Tokyo: +81 3 6859 8575