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| Press Releases |
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| Thursday, March 30, 2017 |
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Hua Hong Semiconductor Power Discrete Platform Crosses the 5-Million Wafer Shipment Mark |
| Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry, today announced that its power discrete platform has crossed the shipment mark of 5-million wafers. more info >> |
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| Thursday, February 16, 2017 |
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华虹半导体2016年金融IC卡芯片出货量实现翻番 |
| 全球领先的200mm纯晶圆代工厂——华虹半导体有限公司（「华虹半导体」或「公司」，连同其附属公司，统称「集团」，股份代号：1347.HK）今天宣布，公司2016年金融IC卡芯片出货量同比增长超过一倍，实现翻番。 more info >> |
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華虹半導體2016年金融IC卡芯片出貨量實現翻番 |
| 全球領先的200mm純晶圓代工廠——華虹半導體有限公司（「華虹半導體」或「公司」，連同其附屬公司，統稱「集團」，股份代號：1347.HK）今天宣佈，公司2016年金融IC卡芯片出貨量同比增長超過一倍，實現翻番。 more info >> |
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Hua Hong Semiconductor Doubles its Financial IC Card Chips Shipment in 2016 |
| Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry more info >> |
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| Monday, January 23, 2017 |
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华虹半导体第三代Super Junction技术研发取得阶段性成果 |
全球领先的200mm纯晶圆代工厂——华虹半导体有限公司（「华虹半导体」或「公司」，连同其附属公司，统称「集团」，股份代号：1347.HK）今天宣布，公司已完成第三代Super Junction（「超级结结构」）MOSFET（「SJNFET」）工艺平台的第一阶段研发，取得了初步成果，并计划在2017年上半年逐步推向市场。
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華虹半導體第三代Super Junction技術研發取得階段性成果 |
全球領先的200mm純晶圓代工廠——華虹半導體有限公司（「華虹半導體」或「公司」，連同其附屬公司，統稱「集團」，股份代號：1347.HK）今天宣佈，公司已完成第三代Super Junction（「超級結結構」）MOSFET（「SJNFET」）工藝平台的第一階段研發，取得了初步成果，並計劃在2017年上半年逐步推向市場。
more info >> |
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| Friday, October 3, 2014 |
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華虹半導體(1347)盈利能力強勁 行業板塊發展潛力吸引 |
雖然大市疲弱，近期仍有多隻新股計劃上市，其中正在招股的華虹半導體 (1347) 基本因素穩健，所處的行業獲國策支援，未來表現值得期待。
more info >> |
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| Monday, January 23, 2017 |
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Hua Hong Semiconductor Achieves a Major Milestone in R&D of the Third-Generation Super Junction Technology |
Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry, today announced that it has achieved an initial success by concluding the Stage I in its R&D of the third-generation Super Junction MOSFET ("SJNFET") process platform, which will be introduced to the market gradually in the first half of 2017.
more info >> |
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| Thursday, October 20, 2016 |
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基于华虹宏力eNVM工艺技术的StarChip银行卡安全芯片获得万事达CQM认证 |
| 基于华虹宏力eNVM工艺技术的StarChip银行卡安全芯片获得万事达CQM认证 more info >> |
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基於華虹宏力eNVM工藝技術的StarChip銀行卡安全芯片獲得萬事達CQM認證 |
| 基於華虹宏力eNVM工藝技術的StarChip銀行卡安全芯片獲得萬事達CQM認證 more info >> |
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| Latest Press Releases |
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MHI-AP、シンガポールの廃棄物焼却発電施設のボイラー改造工事を受注
Mar 26, 2026 13:00: JST
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Nissin Foods Announces 2025 Annual Results
Mar 26, 2026 12:21 HKT/SGT
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日清食品公布2025年全年業績
Mar 26, 2026 12:21 HKT/SGT
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日清食品公布2025年全年业绩
Mar 26, 2026 12:21 HKT/SGT
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寵物飆漲74.3%！朝雲集團成鏟屎官心頭好
Mar 26, 2026 11:20 HKT/SGT
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朝雲集團營收純利連續3年增長 寵物猛增74.3%
Mar 26, 2026 11:20 HKT/SGT
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CALB (03931.HK) Achieves Mass Production Roll-off of Pioneering Aviation Battery System, Powered by Advanced R46 Cylindrical Batteries
Mar 26, 2026 10:56 HKT/SGT
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中創新航航空級電池量產下線 率先實現飛行汽車電池規模化交付
Mar 26, 2026 10:56 HKT/SGT
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中创新航航空级电池量产下线 率先实现飞行汽车电池规模化交付
Mar 26, 2026 10:56 HKT/SGT
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Everest Medicines Enters into Asset Purchase Agreement for Etripamil Nasal Spray, Expanding Cardiovascular Footprint
Mar 26, 2026 10:49 HKT/SGT
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Royal Healthcare in Singapore provides NEC's "FonesVisuas Test" for Disease Risk Prediction
Mar 26, 2026 11:21 JST
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MHI-AP Awarded Boiler Retrofit Contract for Waste-to-Energy Facility in Singapore
Mar 26, 2026 11:07 JST
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TransNusa Becomes First Indonesian Airline to Receive Additional Flight Frequencies from World-Renowned Changi Airport in 2026
Mar 26, 2026 09:30 HKT/SGT
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Doubleview Gold, Hat Project 예비 경제성 평가 결과 명확화; 업데이트된 시나리오 B NPV C$72.7억으로 증가
Mar 26, 2026 08:00 HKT/SGT
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Formerra 宣布徵收運輸附加費以因應貨運與物流市場持續的壓力
Mar 26, 2026 04:00 HKT/SGT
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