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| Press Releases |
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| Thursday, March 30, 2017 |
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Hua Hong Semiconductor Power Discrete Platform Crosses the 5-Million Wafer Shipment Mark |
| Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry, today announced that its power discrete platform has crossed the shipment mark of 5-million wafers. more info >> |
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| Thursday, February 16, 2017 |
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华虹半导体2016年金融IC卡芯片出货量实现翻番 |
| 全球领先的200mm纯晶圆代工厂——华虹半导体有限公司（「华虹半导体」或「公司」，连同其附属公司，统称「集团」，股份代号：1347.HK）今天宣布，公司2016年金融IC卡芯片出货量同比增长超过一倍，实现翻番。 more info >> |
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華虹半導體2016年金融IC卡芯片出貨量實現翻番 |
| 全球領先的200mm純晶圓代工廠——華虹半導體有限公司（「華虹半導體」或「公司」，連同其附屬公司，統稱「集團」，股份代號：1347.HK）今天宣佈，公司2016年金融IC卡芯片出貨量同比增長超過一倍，實現翻番。 more info >> |
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Hua Hong Semiconductor Doubles its Financial IC Card Chips Shipment in 2016 |
| Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry more info >> |
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| Monday, January 23, 2017 |
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华虹半导体第三代Super Junction技术研发取得阶段性成果 |
全球领先的200mm纯晶圆代工厂——华虹半导体有限公司（「华虹半导体」或「公司」，连同其附属公司，统称「集团」，股份代号：1347.HK）今天宣布，公司已完成第三代Super Junction（「超级结结构」）MOSFET（「SJNFET」）工艺平台的第一阶段研发，取得了初步成果，并计划在2017年上半年逐步推向市场。
more info >> |
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華虹半導體第三代Super Junction技術研發取得階段性成果 |
全球領先的200mm純晶圓代工廠——華虹半導體有限公司（「華虹半導體」或「公司」，連同其附屬公司，統稱「集團」，股份代號：1347.HK）今天宣佈，公司已完成第三代Super Junction（「超級結結構」）MOSFET（「SJNFET」）工藝平台的第一階段研發，取得了初步成果，並計劃在2017年上半年逐步推向市場。
more info >> |
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| Friday, October 3, 2014 |
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華虹半導體(1347)盈利能力強勁 行業板塊發展潛力吸引 |
雖然大市疲弱，近期仍有多隻新股計劃上市，其中正在招股的華虹半導體 (1347) 基本因素穩健，所處的行業獲國策支援，未來表現值得期待。
more info >> |
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| Monday, January 23, 2017 |
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Hua Hong Semiconductor Achieves a Major Milestone in R&D of the Third-Generation Super Junction Technology |
Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry, today announced that it has achieved an initial success by concluding the Stage I in its R&D of the third-generation Super Junction MOSFET ("SJNFET") process platform, which will be introduced to the market gradually in the first half of 2017.
more info >> |
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| Thursday, October 20, 2016 |
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基于华虹宏力eNVM工艺技术的StarChip银行卡安全芯片获得万事达CQM认证 |
| 基于华虹宏力eNVM工艺技术的StarChip银行卡安全芯片获得万事达CQM认证 more info >> |
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基於華虹宏力eNVM工藝技術的StarChip銀行卡安全芯片獲得萬事達CQM認證 |
| 基於華虹宏力eNVM工藝技術的StarChip銀行卡安全芯片獲得萬事達CQM認證 more info >> |
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| Latest Press Releases |
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國泰君安國際保薦長光辰芯登陸港交所主板
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国泰君安国际保荐长光辰芯登陆港交所主板
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三菱商事、2026年度 取締役人事に係る件
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4th ASEAN Procurement Innovation Summit & Awards 2026
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Mitani Sangyo Filed U.S. Patent Application for AI Reliability Governance Framework
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Datavault AI 於紐約和費城啟用首批邊緣 GPU 據點；價值 14.4 億至 19.2 億美元的量子就緒機隊，預計將於 2026 年底前覆蓋全美 100 多個城市
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Datavault AI在纽约和费城的首批边缘GPU站点正式投入运营；价值14.4亿至19.2亿美元的抗量子计算集群将于2026年底前覆盖全美100多个城市
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TANAKA PRECIOUS METAL NEXT Certified as a Special Subsidiary
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InnoEX and Electronics Fair (Spring Edition) attract over 88,000 global buyers
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Focus Graphite Appoints Former Chief of the Defence Staff General Wayne Eyre to Advisory Board
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