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| Press Releases |
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| Thursday, March 30, 2017 |
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Hua Hong Semiconductor Power Discrete Platform Crosses the 5-Million Wafer Shipment Mark |
| Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry, today announced that its power discrete platform has crossed the shipment mark of 5-million wafers. more info >> |
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| Thursday, February 16, 2017 |
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华虹半导体2016年金融IC卡芯片出货量实现翻番 |
| 全球领先的200mm纯晶圆代工厂——华虹半导体有限公司（「华虹半导体」或「公司」，连同其附属公司，统称「集团」，股份代号：1347.HK）今天宣布，公司2016年金融IC卡芯片出货量同比增长超过一倍，实现翻番。 more info >> |
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華虹半導體2016年金融IC卡芯片出貨量實現翻番 |
| 全球領先的200mm純晶圓代工廠——華虹半導體有限公司（「華虹半導體」或「公司」，連同其附屬公司，統稱「集團」，股份代號：1347.HK）今天宣佈，公司2016年金融IC卡芯片出貨量同比增長超過一倍，實現翻番。 more info >> |
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Hua Hong Semiconductor Doubles its Financial IC Card Chips Shipment in 2016 |
| Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry more info >> |
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| Monday, January 23, 2017 |
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华虹半导体第三代Super Junction技术研发取得阶段性成果 |
全球领先的200mm纯晶圆代工厂——华虹半导体有限公司（「华虹半导体」或「公司」，连同其附属公司，统称「集团」，股份代号：1347.HK）今天宣布，公司已完成第三代Super Junction（「超级结结构」）MOSFET（「SJNFET」）工艺平台的第一阶段研发，取得了初步成果，并计划在2017年上半年逐步推向市场。
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華虹半導體第三代Super Junction技術研發取得階段性成果 |
全球領先的200mm純晶圓代工廠——華虹半導體有限公司（「華虹半導體」或「公司」，連同其附屬公司，統稱「集團」，股份代號：1347.HK）今天宣佈，公司已完成第三代Super Junction（「超級結結構」）MOSFET（「SJNFET」）工藝平台的第一階段研發，取得了初步成果，並計劃在2017年上半年逐步推向市場。
more info >> |
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| Friday, October 3, 2014 |
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華虹半導體(1347)盈利能力強勁 行業板塊發展潛力吸引 |
雖然大市疲弱，近期仍有多隻新股計劃上市，其中正在招股的華虹半導體 (1347) 基本因素穩健，所處的行業獲國策支援，未來表現值得期待。
more info >> |
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| Monday, January 23, 2017 |
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Hua Hong Semiconductor Achieves a Major Milestone in R&D of the Third-Generation Super Junction Technology |
Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry, today announced that it has achieved an initial success by concluding the Stage I in its R&D of the third-generation Super Junction MOSFET ("SJNFET") process platform, which will be introduced to the market gradually in the first half of 2017.
more info >> |
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| Thursday, October 20, 2016 |
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基于华虹宏力eNVM工艺技术的StarChip银行卡安全芯片获得万事达CQM认证 |
| 基于华虹宏力eNVM工艺技术的StarChip银行卡安全芯片获得万事达CQM认证 more info >> |
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基於華虹宏力eNVM工藝技術的StarChip銀行卡安全芯片獲得萬事達CQM認證 |
| 基於華虹宏力eNVM工藝技術的StarChip銀行卡安全芯片獲得萬事達CQM認證 more info >> |
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| Latest Press Releases |
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三菱造船と日本製鉄が低圧液化CO₂タンクの新規鋼材と熱処理（PWHT）省略技術を開発
Dec 5, 2025 11:30: JST
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LEXUS、バッテリーEVスポーツカーのコンセプトモデル「Lexus LFA Concept」を世界初公開
Dec 5, 2025 11:20: JST
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Doubleview Extends High-Grade Domains at Hat: H099 Returns 438m of 0.40% CuEq Including 52m of 1.02% CuEq, Expanding Mineralization Envelope Around Conceptual Pit Vertically and Laterally
Dec 4, 2025 21:59 HKT/SGT
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Business of IP Asia (BIP Asia) Forum and Entrepreneur Day open today
Dec 4, 2025 21:00 HKT/SGT
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CaoCao Unveils '100 Cities, 100 Billion in 10 Years' Robotaxi Strategy, Officially Launches World's First 'Green Intelligent Mobility Hub'
Dec 4, 2025 21:00 HKT/SGT
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曹操出行發佈Robotaxi「十年百城千億」戰略目標 全球首個「綠色智慧通行島」正式啟用
Dec 4, 2025 18:18 HKT/SGT
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The Gourmet's Guide: Using Your TravelKon eSIM to Hunt for Japan's Best Ramen, Sushi, and Street Food
Dec 4, 2025 17:45 HKT/SGT
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Oman's 10-Year Golden Residency Program Attracts Global Investors Seeking Stability and Long-Term Access
Dec 4, 2025 16:19 HKT/SGT
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Spritzer Celebrates Global and Regional Brand Excellence 2025
Dec 4, 2025 12:45 HKT/SGT
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Honda、新型「CR-V」の先行予約開始
Dec 4, 2025 11:30: JST
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在聯泓格潤「超級工廠」看見綠色材料全鏈路
Dec 4, 2025 09:36 HKT/SGT
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在联泓格润"超级工厂" 看见绿色材料全链路
Dec 4, 2025 09:14 HKT/SGT
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阿曼十年黃金居留計劃吸引全球投資者尋求穩定與長期通達
Dec 4, 2025 08:00 HKT/SGT
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阿曼十年黄金居留计划吸引全球投资者寻求稳定与长期准入
Dec 4, 2025 08:00 HKT/SGT
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The 26th Hong Kong Forum marks successful completion
Dec 3, 2025 22:44: JST
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